A17819-15
Laird Technologies - Thermal Materials
A17819-15
Laird Technologies - Thermal Materials
TFLEX HD93750,DC1
Reference Price (USD)
1+
$1616.19000
500+
$1600.0281
1000+
$1583.8662
1500+
$1567.7043
2000+
$1551.5424
2500+
$1535.3805
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
A17819-15
$1,616.19
Product details
Laird Technologies - Thermal Materials's A17819-15 delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.As a premium Gap Filler Pad, Sheet, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Available in precision Square configurations, this material enables optimal thermal pathway design for complex RF modules. The geometrically optimized profiles ensure maximum heat transfer efficiency.Standard 457.20mm x 457.20mm sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise 0.148" (3.75mm) control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.The advanced Silicone, Ceramic Filled formulation offers exceptional resistance to high-temperature aging effects. This characteristic ensures long-term reliability in continuous operation scenarios.Featuring Tacky - One Side properties, this solution offers reliable component bonding without outgassing concerns. This characteristic is critical for maintaining clean environments in precision RF assemblies.The Gray coding system facilitates quick material identification during assembly processes. This feature streamlines production workflows in high-mix manufacturing environments.Delivering 7.5W/m-K performance, this solution enables more efficient thermal designs for high-power RF applications. The material's consistent performance helps maintain signal integrity in sensitive circuits.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 457.20mm x 457.20mm
- Thickness: 0.148" (3.75mm)
- Material: Silicone, Ceramic Filled
- Adhesive: Tacky - One Side
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 7.5W/m-K
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