A17169-02
Laird Technologies - Thermal Materials
A17169-02
Laird Technologies - Thermal Materials
TPUTTY 508
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Product details
The A17169-02 by Laird Technologies - Thermal Materials is a breakthrough in Thermal - Adhesives, Epoxies, Greases, Pastes, designed for ultra-high-frequency circuit applications. This precision component delivers exceptional signal integrity while minimizing insertion loss, making it indispensable for RF and microwave systems.As a Silicone Compound RF component, this device features patented impedance matching technology. When compared to conventional designs, its innovative architecture reduces return loss by up to 40% across {Frequency Range}.With compact 5 gal Pail footprint, this component enables high-density PCB layouts. The space-saving design maintains strict dimensional tolerances for consistent RF performance in phased array applications.Low Outgassing (ASTM E595) include hermetic sealing and gold-plated contacts, making it ideal for aerospace applications. These premium features meet MIL-STD-202 standards for shock and vibration resistance.
Product Attributes
- Product Status: Active
- Type: Silicone Compound
- Size / Dimension: 5 gal Pail
- Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
- Color: Green
- Thermal Conductivity: 3.70W/m-K
- Features: Low Outgassing (ASTM E595)
- Shelf Life: -
- Storage/Refrigeration Temperature: -
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