A16366-41
Laird Technologies - Thermal Materials
A16366-41
Laird Technologies - Thermal Materials
TFLEX SF610
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Product details
The A16366-41 from Laird Technologies - Thermal Materials represents a significant advancement in Thermal - Pads, Sheets for industrial automation systems. This robust thermal solution is specifically designed to meet the demanding requirements of factory automation equipment and industrial control systems.As a high-reliability Gap Filler Pad, Sheet, this product offers exceptional long-term stability under continuous operation. The material maintains its thermal properties even after extended exposure to industrial operating conditions.Precision-engineered in Square formats, this solution enables efficient thermal management of industrial power electronics. The optimized geometries ensure maximum contact area with heat-generating components.Available in 457.20mm x 457.20mm sizes, this material accommodates both large motor drives and compact control modules. The standardized dimensions ensure compatibility with common industrial enclosure designs.The carefully controlled 0.0100" (0.254mm) provides optimal balance between thermal transfer and mechanical compliance. This characteristic is particularly valuable in applications subject to mechanical vibration.Formulated with industrial-grade Non-Silicone, Boron Nitride Filled, this pad exhibits exceptional resistance to oils and chemicals. This property ensures reliable performance in harsh manufacturing environments.The Pink identification system enables quick visual verification during maintenance procedures. This feature simplifies component replacement in complex industrial systems.Achieving 3.0W/m-K performance, this solution enables more efficient cooling of industrial power electronics. The material's consistent performance helps extend component lifespan in demanding applications.
Product Attributes
- Product Status: Obsolete
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 457.20mm x 457.20mm
- Thickness: 0.0100" (0.254mm)
- Material: Non-Silicone, Boron Nitride Filled
- Adhesive: -
- Backing, Carrier: -
- Color: Pink
- Thermal Resistivity: -
- Thermal Conductivity: 3.0W/m-K
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