A15819-04

The A15819-04 from Laird Technologies - Thermal Materials represents a cutting-edge solution in Thermal - Adhesives, Epoxies, Greases, Pastes, engineered for high-performance thermal management applications. This advanced material delivers exceptional heat dissipation while maintaining optimal viscosity across extreme operating conditions. With its specialized formulation, it addresses critical challenges in modern electronics cooling systems.As a Silicone Compound thermal interface material, this product provides superior thermal coupling between components. When compared to conventional compounds, its unique composition ensures minimal thermal resistance under {Usable Temperature Range} conditions.Operating within 257°F (125°C), this thermal compound maintains stable performance characteristics. Whether subjected to cryogenic temperatures or elevated thermal loads, its molecular structure remains intact for reliable heat transfer.The distinctive White pigmentation serves as a visual indicator for quality control during application. This chromatic feature aids in uniform distribution verification while meeting industry-standard identification protocols.With 1.20W/m-K thermal conductivity, this material outperforms conventional thermal interfaces by 15-20%. Its optimized thermal pathway architecture significantly reduces junction temperatures in power electronics.Low Outgassing (ASTM E595) characteristics make this product ideal for aerospace and military applications where outgassing prevention is critical. These specialized properties meet stringent ASTM standards for volatile emissions.