A15401-05

The A15401-05 from Laird Technologies - Thermal Materials represents a breakthrough in Thermal - Pads, Sheets technology, engineered for high-performance thermal management solutions. This advanced thermal interface material delivers exceptional heat dissipation capabilities while maintaining electrical insulation properties. With its innovative composition and precision engineering, this product sets new standards for reliability in demanding applications.Optimized for TO-220, TO-264, TO-247, TO-3P, TO-3PL applications, this thermal solution ensures minimal thermal resistance between components. When deployed in power electronics, it significantly reduces hot spot temperatures compared to conventional materials. Its multi-interface compatibility makes it ideal for complex thermal management systems requiring uniform heat distribution.As a premium Insulator Pad, Sheet, this product combines superior thermal conductivity with mechanical flexibility. Unlike standard interface materials, it maintains consistent performance under varying pressure conditions, making it particularly effective for uneven surface applications.Featuring a precise 0.0500" (1.270mm) profile, this material achieves optimal balance between thermal transfer and mechanical compliance. Thinner variants provide minimal interface resistance, while thicker options offer superior gap-filling capabilities.Constructed from high-grade Polyimide, Ceramic Filled, this pad exhibits exceptional thermal stability across wide temperature ranges. The advanced composite formulation resists degradation while maintaining consistent thermal performance throughout its service life.Featuring Adhesive - One Side properties, this solution offers secure component bonding without compromising reworkability. The pressure-sensitive formulation ensures reliable attachment while allowing for clean removal when required.The distinctive Amber appearance facilitates easy visual inspection during quality control processes. This color-coding system aids in quick identification within complex BOM structures.