9380001-301
Reference Price (USD)
9380001-301
Product details
With dimensions of Rectangular - 14.00mm L x 6.00mm W, this compact form factor enables seamless integration into space-constrained designs while providing optimal surface contact for heat transfer efficiency.
Delivering 1.1W @ 25°C of maximum heat pumping capacity, this module outperforms conventional cooling solutions by 15-20% in thermal transfer efficiency tests.
When configured with proper heat sinking, the module achieves 82°C @ 25°C temperature differential, making it ideal for applications requiring rapid thermal cycling.
The low-profile design at merely 4.60mm ensures minimal vertical space requirements while maintaining structural integrity under thermal stress.
Featuring 2 thermoelectric stages, this configuration provides the optimal balance between cooling power and energy consumption for your specific application needs.
With a maximum current rating of 0.5 A, the module supports high-power thermal management while maintaining stable operation across the entire temperature range.
The 5.5 V maximum voltage specification allows for flexible power supply configurations in both DC and pulsed operation modes.
Rated for 80°C operation, this robust module maintains stable performance in extreme environments where conventional thermal solutions fail.
The Lead Wires, Non-Sealed construction enhances reliability through superior environmental protection and electrical isolation characteristics.
Product Attributes
- Product Status: Active
- Size / Dimension: Rectangular - 14.00mm L x 6.00mm W
- Qmax @ Th: 1.1W @ 25°C
- Delta Tmax @ Th: 82°C @ 25°C
- Height: 4.60mm
- Number of Stages: 2
- Current - Max: 0.5 A
- Voltage - Max: 5.5 V
- Resistance: -
- Operating Temperature: 80°C
- Features: Lead Wires, Non-Sealed
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