9340001-319
Laird Thermal Systems, Inc.
9340001-319
Laird Thermal Systems, Inc.
MS2,049,10,10,15,15,21,W8
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Product details
Laird Thermal Systems, Inc.'s 9340001-319 sets new standards for precision cooling in Thermal - Thermoelectric, Peltier Modules applications. Developed for semiconductor test equipment, this Peltier module delivers milli-Kelvin temperature stability and rapid thermal cycling capabilities. Its ultra-clean design prevents contamination in sensitive wafer probing and IC testing environments.<p>The precision-machined Square - 15.00mm L x 15.00mm W surfaces ensure perfect thermal interface with probe card assemblies while maintaining strict flatness tolerances.</p><p>With 3.4W @ 25°C heat pumping capacity, the module maintains exacting temperature control for advanced semiconductor characterization.</p><p>The 87°C @ 25°C maximum temperature differential enables comprehensive device testing across military temperature ranges.</p><p>The 6.50mm vertical dimension has been minimized to reduce thermal mass while maintaining structural integrity in high-cycle test applications.</p><p>The 2-stage architecture provides the gradual temperature transitions required for reliable semiconductor reliability testing.</p><p>Precision current regulation up to 2.1 A enables sub-degree temperature control for sensitive IC characterization.</p><p>The 3.8 V voltage rating accommodates both benchtop and automated test equipment power requirements.</p><p>Certified for 80°C operation, the module performs reliably in burn-in and accelerated life testing applications.</p><p>The Lead Wires, Non-Sealed design prevents particulate generation and outgassing in cleanroom test environments.</p>
Product Attributes
- Product Status: Active
- Size / Dimension: Square - 15.00mm L x 15.00mm W
- Qmax @ Th: 3.4W @ 25°C
- Delta Tmax @ Th: 87°C @ 25°C
- Height: 6.50mm
- Number of Stages: 2
- Current - Max: 2.1 A
- Voltage - Max: 3.8 V
- Resistance: -
- Operating Temperature: 80°C
- Features: Lead Wires, Non-Sealed
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