9-1437504-8
TE Connectivity AMP Connectors
9-1437504-8
TE Connectivity AMP Connectors
CONN SOCKET TRANSIST TO-3 3POS
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Product details
The 9-1437504-8 from TE Connectivity AMP Connectors delivers military-grade performance for Sockets for ICs, Transistors applications in defense systems. Designed to exceed MIL-STD-883 requirements, this socket ensures mission success in extreme conditions.Featuring Transistor, TO-3 configuration, the socket provides EMP protection for sensitive electronics. Testing confirms survivability in 50kV/m transient electromagnetic fields.With 3 (Oval), the socket supports ruggedized avionics designs. The reinforced grid pattern withstands 100G mechanical shock per MIL-STD-810H.The Silver finish resists corrosion in salt fog. Testing per MIL-STD-202G Method 101 shows no degradation after 1000 hours.50.0µin (1.27µm) thickness ensures long-term reliability. Accelerated life testing predicts 20-year service in naval applications.Constructed with Beryllium Copper, the socket withstands ballistic impacts. Testing confirms functionality after 30g 11ms half-sine shock pulses.The Chassis Mount design prevents loosening in vibration. Testing per MIL-STD-167-1 shows zero connection loss at 29Hz-2kHz random vibration.Incorporating Closed Frame, the socket provides NBC (Nuclear, Biological, Chemical) protection. Sealing tests confirm operation after immersion in decontamination solutions.Solder technology ensures reliability in high-altitude conditions. Testing confirms operation at 70,000 feet with <1% contact resistance change.The Beryllium Copper posts resist stress corrosion cracking. Testing per ASTM G36 shows no cracking after 1000 hours in boiling MgCl2.Diallyl Phthalate (DAP) housing material provides radar absorption. Testing shows -20dB RCS reduction compared to metal housings.Rated for -55°C ~ 125°C, the socket operates in arctic to desert conditions. Testing confirms functionality during rapid -65 C to +125 C transitions.
Product Attributes
- Product Status: Obsolete
- Type: Transistor, TO-3
- Number of Positions or Pins (Grid): 3 (Oval)
- Pitch - Mating: -
- Contact Finish - Mating: Silver
- Contact Finish Thickness - Mating: 50.0µin (1.27µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Chassis Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Diallyl Phthalate (DAP)
- Operating Temperature: -55°C ~ 125°C
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