858-22-005-80-611101
Mill-Max Manufacturing Corp.
858-22-005-80-611101
Mill-Max Manufacturing Corp.
STD SPRING-LOADED CONNECTOR
Reference Price (USD)
1+
$17.95500
500+
$17.77545
1000+
$17.5959
1500+
$17.41635
2000+
$17.2368
2500+
$17.05725
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
858-22-005-80-611101
$17.96
Product details
The 858-22-005-80-611101 by Mill-Max Manufacturing Corp. establishes new benchmarks in Rectangular Connectors - Spring Loaded technology, specifically engineered for aerospace-grade signal transmission systems. Its advanced architecture ensures flawless performance in extreme environmental conditions.Employing Piston topology, this solution provides military-grade EMI shielding effectiveness, critical for avionics systems and satellite communication payloads.Precision-aligned 5 contacts maintain impedance control for high-speed differential pairs in radar signal processing units.The 0.157" (4.00mm) micro-pitch configuration enables ultra-high-density packaging while preserving signal integrity up to 40GHz for phased array antenna systems.With 1 rows arranged in staggered formation, this design minimizes crosstalk in multi-channel data acquisition systems.The Through Hole interface incorporates hermetic sealing technology for operation in vacuum environments and high-altitude applications.Aerospace-certified Copper Alloy alloy maintains dimensional stability across -65 C to +200 C thermal cycles in space vehicle applications.Proprietary Gold plating prevents cold welding in zero-gravity conditions while ensuring reliable mating cycles.The 20.0µin (0.51µm) gold overlay is optimized for RF signal transmission with minimal insertion loss in microwave systems.
Product Attributes
- Product Status: Active
- Connector Type: Piston
- Number of Contacts: 5
- Pitch: 0.157" (4.00mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Through Hole
- Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 20.0µin (0.51µm)
You May Also Be Interested In