84553-A01

The 84553-A01 from Amphenol ICC (FCI) is a high-performance Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) engineered for demanding board-to-board applications. This connector delivers exceptional signal integrity and power distribution capabilities, making it ideal for 5G base stations and high-speed computing systems. With its advanced contact technology and robust construction, it ensures reliable performance in harsh operating environments.Featuring a Array, Female Sockets configuration, this solution provides optimal mating stability while minimizing insertion loss. When compared to conventional designs, the patented contact geometry reduces crosstalk by up to 30%.Available in 300 contact arrangements, the connector supports flexible power delivery configurations. System designers can choose between signal-dominant or power-optimized layouts based on application requirements.The ultra-fine 0.050" (1.27mm) spacing enables high-density PCB layouts without compromising signal integrity. This precision spacing is particularly beneficial for miniaturized RF modules and compact embedded systems.With 10 rows configuration, the connector achieves balanced impedance characteristics across all channels. The symmetrical layout minimizes skew variation for high-speed differential pairs.Designed for Surface Mount installation, this connector simplifies assembly processes while maintaining mechanical robustness. The mounting system has been validated for automated pick-and-place operations.The precisely controlled 30.0µin (0.76µm) ensures consistent electrical performance while providing adequate wear resistance. This thickness specification meets MIL-STD-202H for military applications.Supporting 8mm, 14mm stacking options, the connector enables flexible system architecture designs. Engineers can optimize space utilization in multi-board systems.With 0.289" (7.35mm) profile, the connector maintains low aerodynamic interference in forced-air cooling systems. The optimized height contributes to better thermal management.