837-050-500-803
EDAC Inc.
837-050-500-803
EDAC Inc.
837 HIGH TEMP' SERIES (.156" (3.
Reference Price (USD)
1+
$140.45840
500+
$139.053816
1000+
$137.649232
1500+
$136.244648
2000+
$134.840064
2500+
$133.43548
Exquisite packaging
Discount
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837-050-500-803
$140.46
Product details
EDAC Inc.'s 837-050-500-803 delivers breakthrough performance in Card Edge Connectors - Edgeboard Connectors for industrial IoT edge devices. Optimized for Industry 4.0 applications, this connector combines robust construction with smart connectivity features.Supporting Non Specified - Dual Edge standards, the design features protocol-agnostic interfaces. The universal contact arrangement accommodates 15+ industrial fieldbus protocols without hardware changes.The Female configuration includes smart latching. The electronic interlock provides digital mating confirmation to the host controller via IO-Link interface.With 25 contacts per row, the layout supports hybrid power+data. The integrated power contacts deliver 10A alongside 1Gbps Ethernet signals.The 50 contact array enables edge computing. The arrangement provides 32 GPIO channels plus 4 differential pairs for sensor aggregation.Compatible with 0.054" ~ 0.070" (1.37mm ~ 1.78mm) industrial PCBs, the connector features vibration-resistant contacts. The dual-spring design maintains connection through 10G random vibration.The 2 row architecture includes surge protection. Each I/O line incorporates 1.5kV TVS diodes for overvoltage protection in harsh electrical environments.The 0.156" (3.96mm) pitch design enables IP69K sealing. The overmolded gasket geometry prevents water ingress at 100bar pressure washing.Dual capability provides condition monitoring. Integrated temperature and humidity sensors report environmental data via SMBus interface.The Through Hole version includes tool-less installation. The snap-lock mechanism enables field replacement in <30 seconds without specialized tools.Solder Eyelet(s) process ensures reliable connections. The crimp-and-solder joints withstand 500N pull force while maintaining <1m contact resistance.The Copper Alloy contacts resist industrial chemicals. Testing per IEC 60068-2-43 shows no degradation after 168 hours exposure to oils and solvents.Gold plating provides long-term reliability. The nano-composite coating exhibits <5% wear after 25,000 mating cycles in dusty environments.With 10.0µin (0.25µm) plating, the contacts achieve EMI shielding >60dB up to 2.4GHz. This prevents interference with industrial wireless networks.The Cantilever design includes self-cleaning action. The 8mm contact wipe removes oxide buildup during each mating cycle.The Green housing incorporates status indicators. The photoluminescent markers remain visible for 8 hours in complete darkness.Top Mount Opening, Floating Bobbin, 0.116" (2.95mm) Dia includes cable strain relief. The 360 compression gland prevents pull-out forces up to 150N from affecting terminations.Rated for -40°C ~ 125°C, the connector survives thermal shock. Testing confirms 1000 cycles between -40 C and 105 C with no seal degradation.
Product Attributes
- Product Status: Active
- Card Type: Non Specified - Dual Edge
- Gender: Female
- Number of Positions/Bay/Row: 25
- Number of Positions: 50
- Card Thickness: 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
- Number of Rows: 2
- Pitch: 0.156" (3.96mm)
- Read Out: Dual
- Features: -
- Mounting Type: Through Hole
- Termination: Solder Eyelet(s)
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Contact Type: Cantilever
- Color: Green
- Flange Feature: Top Mount Opening, Floating Bobbin, 0.116" (2.95mm) Dia
- Operating Temperature: -40°C ~ 125°C
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