837-018-559-202
EDAC Inc.
837-018-559-202
EDAC Inc.
837 HIGH TEMP' SERIES (.156" (3.
Reference Price (USD)
1+
$65.09480
500+
$64.443852
1000+
$63.792904
1500+
$63.141956
2000+
$62.491008
2500+
$61.84006
Exquisite packaging
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837-018-559-202
$65.09
Product details
EDAC Inc.'s 837-018-559-202 delivers cutting-edge performance in Card Edge Connectors - Edgeboard Connectors for 5G infrastructure. Precision-engineered for RF signal integrity, this connector minimizes insertion loss while maximizing power handling capacity.The Non Specified - Dual Edge compatible design features impedance-matched transitions. The graduated dielectric constant maintains <1.2 VSWR up to 40GHz.The Female configuration includes RF shielding continuity. Multi-finger gaskets provide 360 shielding with <2m contact resistance at grounding points.With 9 contacts per bay, the layout optimizes RF performance. Ground-signal-ground arrangement minimizes crosstalk between adjacent channels.The 18 contact configuration supports massive MIMO arrays. Each contact path is individually tuned to maintain phase coherence across all channels.Compatible with 0.054" ~ 0.070" (1.37mm ~ 1.78mm) cards, the connector features constant-impedance transitions. The tapered contact design prevents impedance discontinuities at card entry points.The 2 row arrangement incorporates resonant suppression. Quarter-wave stubs integrated into the housing prevent cavity resonances in 24-30GHz bands.The 0.156" (3.96mm) pitch design enables millimeter-wave operation. Electromagnetic simulations verify <-30dB coupling between adjacent contacts at 60GHz.Dual readout capability supports beamforming calibration. Integrated test ports allow vector network analyzer measurements without disassembly.The Through Hole, Right Angle version includes thermal management features. The aluminum housing provides 5 C/W thermal resistance for power amplifier cooling.Solder process maintains RF performance. The solder joint geometry is optimized to minimize parasitic inductance (<0.5nH per contact).The Copper Alloy contacts exhibit excellent high-frequency characteristics. Skin effect resistance is 30% lower than standard alloys at 28GHz.Gold plating provides stable RF performance. Surface roughness is controlled to <0.2 m RMS to minimize conductor loss at microwave frequencies.With 10.0µin (0.25µm) gold plating, the contacts achieve <0.1dB insertion loss per contact at 40GHz. This specification meets 5G fronthaul requirements.The Cantilever design includes controlled impedance transitions. The graduated contact shape maintains 50 characteristic impedance throughout the mating interface.The Green housing incorporates RF-absorbent material. This carbon-loaded polymer reduces surface wave propagation by 15dB at 60GHz.Flush Mount, Top Opening, Unthreaded, 0.128" (3.25mm) Dia includes precision alignment pins. These ground-return features maintain <0.1mm positional accuracy for repeatable RF performance.Rated for -40°C ~ 125°C, the connector uses low-dK materials. The dielectric constant varies less than 2% across the temperature range.
Product Attributes
- Product Status: Active
- Card Type: Non Specified - Dual Edge
- Gender: Female
- Number of Positions/Bay/Row: 9
- Number of Positions: 18
- Card Thickness: 0.054" ~ 0.070" (1.37mm ~ 1.78mm)
- Number of Rows: 2
- Pitch: 0.156" (3.96mm)
- Read Out: Dual
- Features: -
- Mounting Type: Through Hole, Right Angle
- Termination: Solder
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Contact Type: Cantilever
- Color: Green
- Flange Feature: Flush Mount, Top Opening, Unthreaded, 0.128" (3.25mm) Dia
- Operating Temperature: -40°C ~ 125°C
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