826-22-020-00-005000
Mill-Max Manufacturing Corp.
826-22-020-00-005000
Mill-Max Manufacturing Corp.
CONN SPRING PISTON 20POS SLD PCB
Reference Price (USD)
1+
$25.34800
500+
$25.09452
1000+
$24.84104
1500+
$24.58756
2000+
$24.33408
2500+
$24.0806
Exquisite packaging
Discount
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826-22-020-00-005000
$25.35
Product details
The 826-22-020-00-005000 by Mill-Max Manufacturing Corp. establishes new benchmarks in Rectangular Connectors - Spring Loaded technology, specifically engineered for aerospace-grade signal transmission systems. Its advanced architecture ensures flawless performance in extreme environmental conditions.Employing Piston topology, this solution provides military-grade EMI shielding effectiveness, critical for avionics systems and satellite communication payloads.Precision-aligned 20 contacts maintain impedance control for high-speed differential pairs in radar signal processing units.The 0.100" (2.54mm) micro-pitch configuration enables ultra-high-density packaging while preserving signal integrity up to 40GHz for phased array antenna systems.With 2 rows arranged in staggered formation, this design minimizes crosstalk in multi-channel data acquisition systems.0.100" (2.54mm) spacing configuration incorporates built-in Faraday cage elements for sensitive instrumentation in scientific payloads.The Through Hole, Solder Cup interface incorporates hermetic sealing technology for operation in vacuum environments and high-altitude applications.Aerospace-certified Beryllium Copper alloy maintains dimensional stability across -65 C to +200 C thermal cycles in space vehicle applications.Proprietary Gold plating prevents cold welding in zero-gravity conditions while ensuring reliable mating cycles.The 20.0µin (0.51µm) gold overlay is optimized for RF signal transmission with minimal insertion loss in microwave systems.
Product Attributes
- Product Status: Active
- Connector Type: Piston
- Number of Contacts: 20
- Pitch: 0.100" (2.54mm)
- Number of Rows: 2
- Row Spacing: 0.100" (2.54mm)
- Mounting Type: Through Hole, Solder Cup
- Material: Beryllium Copper
- Contact Finish: Gold
- Contact Finish Thickness: 20.0µin (0.51µm)
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