813-SS-008-30-006191

Preci-Dip's 813-SS-008-30-006191 sets new standards in Rectangular Connectors - Spring Loaded technology, offering unparalleled performance in next-generation communication systems. Its innovative design addresses critical challenges in high-frequency signal integrity and power distribution.Utilizing Piston architecture, this connector achieves exceptional EMI shielding performance, making it ideal for sensitive measurement equipment and 5G infrastructure.The 8 contact configuration supports parallel power delivery and high-speed data transmission, enabling compact system designs for IoT edge devices.Precision-engineered 0.100" (2.54mm) pitch allows for high-density interconnects while maintaining signal integrity up to 10Gbps, meeting stringent requirements for server backplane applications.The 2 row arrangement provides balanced mechanical stress distribution during mating cycles, extending product lifespan in industrial robotics applications.0.100" (2.54mm) row spacing configuration enables effective crosstalk suppression while accommodating standard PCB fabrication tolerances.Surface Mount interface design facilitates automated assembly processes while ensuring reliable solder joint formation under thermal stress conditions.Selected Brass alloy offers optimal spring characteristics and thermal conductivity, critical for power electronics applications requiring efficient heat dissipation.Advanced Gold surface treatment minimizes insertion force while maintaining stable contact resistance across temperature extremes from -40 C to +125 C.The 19.7µin (0.50µm) plating thickness is optimized for wear resistance and corrosion protection in marine and aerospace applications.