8080-1G39
TE Connectivity AMP Connectors
8080-1G39
TE Connectivity AMP Connectors
CONN TRANSIST TO-3 3POS GOLD
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Product details
The 8080-1G39 from TE Connectivity AMP Connectors delivers military-grade performance for Sockets for ICs, Transistors applications in defense systems. Designed to exceed MIL-STD-883 requirements, this socket ensures mission success in extreme conditions.Featuring Transistor, TO-3 configuration, the socket provides EMP protection for sensitive electronics. Testing confirms survivability in 50kV/m transient electromagnetic fields.With 3 (Oval), the socket supports ruggedized avionics designs. The reinforced grid pattern withstands 100G mechanical shock per MIL-STD-810H.The Gold finish resists corrosion in salt fog. Testing per MIL-STD-202G Method 101 shows no degradation after 1000 hours.Constructed with Beryllium Copper, the socket withstands ballistic impacts. Testing confirms functionality after 30g 11ms half-sine shock pulses.The Chassis Mount design prevents loosening in vibration. Testing per MIL-STD-167-1 shows zero connection loss at 29Hz-2kHz random vibration.Incorporating Closed Frame, the socket provides NBC (Nuclear, Biological, Chemical) protection. Sealing tests confirm operation after immersion in decontamination solutions.Solder technology ensures reliability in high-altitude conditions. Testing confirms operation at 70,000 feet with <1% contact resistance change.Gold plating prevents galvanic corrosion. Testing in marine environments shows no measurable degradation after 5 years.The Beryllium Copper posts resist stress corrosion cracking. Testing per ASTM G36 shows no cracking after 1000 hours in boiling MgCl2.Polytetrafluoroethylene (PTFE) housing material provides radar absorption. Testing shows -20dB RCS reduction compared to metal housings.Rated for -55°C ~ 125°C, the socket operates in arctic to desert conditions. Testing confirms functionality during rapid -65 C to +125 C transitions.
Product Attributes
- Product Status: Obsolete
- Type: Transistor, TO-3
- Number of Positions or Pins (Grid): 3 (Oval)
- Pitch - Mating: -
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Chassis Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polytetrafluoroethylene (PTFE)
- Operating Temperature: -55°C ~ 125°C
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