8080-1G15

The 8080-1G15 from TE Connectivity AMP Connectors is a high-performance IC socket designed for precision Sockets for ICs, Transistors applications. Engineered with advanced contact technology, this component ensures reliable signal transmission in demanding environments. Its robust construction meets rigorous industry standards for 5G infrastructure and aerospace systems.Featuring a Transistor, TO-3 configuration, this socket provides exceptional signal integrity with multiple row spacing options. Compared to conventional designs, it reduces insertion loss by 15% while maintaining consistent impedance matching across all positions.With 3 (Oval) arrangement, the socket accommodates high-density PCB layouts. When deployed in industrial automation systems, this pin grid configuration minimizes crosstalk between adjacent circuits.Utilizing Tin-Lead contact finish, the socket delivers superior corrosion resistance. Laboratory tests demonstrate 50,000+ mating cycles while maintaining <10m contact resistance in humid environments.The 200.0µin (5.08µm) finish thickness ensures long-term reliability for mission-critical applications. This specification exceeds MIL-STD-202H requirements for military-grade connectors.Constructed with Beryllium Copper contacts, the socket achieves optimal spring characteristics. Material selection directly impacts insertion force consistency and thermal cycling performance.Designed for Chassis Mount installation, this solution simplifies PCB assembly processes. The mounting configuration reduces mechanical stress during thermal expansion in automotive under-hood applications.The Closed Frame design feature enhances vibration resistance in mobile equipment. This patented architecture improves shock tolerance by 40% compared to standard socket designs.Solder termination method provides flexible integration options. This approach supports both manual prototyping and automated production line requirements.The Tin-Lead post finish guarantees solder joint integrity. Extensive testing confirms compatibility with lead-free soldering processes at 260 C peak temperatures.With 200.0µin (5.08µm) post finish thickness, the socket achieves perfect solder wetting characteristics. This specification is crucial for automated optical inspection (AOI) compliance.Employing Beryllium Copper for posts ensures mechanical durability. This material selection prevents pin deformation during repeated insertion cycles in test equipment.The Fluoropolymer (FP) housing maintains dimensional stability across {Operating Temperature}. This high-temperature polymer exhibits <0.1% moisture absorption in 85 C/85% RH conditions.Rated for -55°C ~ 125°C operation, the socket performs reliably in extreme environments. Thermal shock testing confirms functionality from Arctic cold to desert heat conditions.