8080-1G13
TE Connectivity AMP Connectors
8080-1G13
TE Connectivity AMP Connectors
CONN TRANSIST TO-3 3POS TIN
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Product details
TE Connectivity AMP Connectors's 8080-1G13 sets new benchmarks for Sockets for ICs, Transistors components in renewable energy systems. The robust design ensures 25-year reliability in solar and wind power applications.The Transistor, TO-3 architecture provides lightning surge protection. Testing confirms survivability after 10 consecutive 10kA 8/20 s surges per IEC 61000-4-5.With 3 (Oval), the socket enables high-current power conversion. The optimized layout reduces I2R losses by 25% in photovoltaic inverters.Featuring Tin-Lead finish, the socket resists sulfur corrosion. Testing in H2S environments shows no degradation after 1000 hours.Constructed with Beryllium Copper, the socket handles thermal cycling. Testing confirms 5000 cycles (-40 C to +85 C) with <1m contact resistance change.The Chassis Mount design resists wind-induced vibration. Testing confirms no loosening after 10^7 cycles at 0.5mm amplitude.Incorporating Closed Frame, the socket prevents PID (Potential Induced Degradation). Testing shows <1% power loss in 1000V biased damp heat conditions.Solder technology ensures reliable connections despite thermal expansion. Testing confirms <0.1mm movement during 100 C temperature swings.Tin-Lead plating prevents fretting in vibrating environments. Testing shows <2m change after 10^8 micro-motions.The Beryllium Copper posts resist stress relaxation. Testing confirms <3% contact force loss after 25 years at 70 C.Polytetrafluoroethylene (PTFE) housing material provides tracking resistance. The material achieves CTI 600 for high-pollution environments.Rated for -55°C ~ 125°C, the socket performs in extreme weather. Testing confirms operation from -40 C to +105 C with 95% RH.
Product Attributes
- Product Status: Obsolete
- Type: Transistor, TO-3
- Number of Positions or Pins (Grid): 3 (Oval)
- Pitch - Mating: -
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Chassis Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: -
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Polytetrafluoroethylene (PTFE)
- Operating Temperature: -55°C ~ 125°C
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