782202F00000G
Aavid, Thermal Division of Boyd Corporation
782202F00000G
Aavid, Thermal Division of Boyd Corporation
78220 EXTRUSION 2.36X1.18"X4.1'
Reference Price (USD)
1+
$194.71000
500+
$192.7629
1000+
$190.8158
1500+
$188.8687
2000+
$186.9216
2500+
$184.9745
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
782202F00000G
$194.71
Product details
Aavid, Thermal Division of Boyd Corporation's 782202F00000G delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 49.500" (1257.30mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 1.181" (30.00mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 2.362" (60.00mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).The 1.50°C/W @ 400 LFM performance is validated under ASHRAE TC9.9 Class A3 conditions. The design maintains stability at airflow rates from 10-25 CFM.Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.
Product Attributes
- Product Status: Active
- Type: Board Level, Vertical, Extrusion
- Package Cooled: -
- Attachment Method: PC Pin
- Shape: Rectangular, Pin Fins
- Length: 49.500" (1257.30mm)
- Width: 1.181" (30.00mm)
- Diameter: -
- Fin Height: 2.362" (60.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 400 LFM
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: -
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