747652F00000G
Aavid, Thermal Division of Boyd Corporation
747652F00000G
Aavid, Thermal Division of Boyd Corporation
74765 EXTRUSION 1.025X4.235"X5'
Reference Price (USD)
1+
$157.94000
500+
$156.3606
1000+
$154.7812
1500+
$153.2018
2000+
$151.6224
2500+
$150.043
Exquisite packaging
Discount
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747652F00000G
$157.94
Product details
The 747652F00000G from Aavid, Thermal Division of Boyd Corporation represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Featuring Push Pin and Thermal Tape options, the mounting system accommodates various PCB thicknesses (0.8-2.4mm). For mission-critical applications, the bolt-on version provides vibration resistance exceeding MIL-STD-810G standards.The Square Fins configuration maximizes surface area-to-volume ratio, achieving {Thermal Resistance @ Forced Air Flow} at minimal airflow. Computational fluid dynamics analysis confirms 20% better laminar flow characteristics than rectangular alternatives.With a compact 60.000" (1524.00mm) profile, this heatsink fits space-constrained designs common in edge computing devices. The optimized aspect ratio prevents airflow stagnation in dense server configurations.The 4.235" (107.57mm) dimension complements standard PCB layouts while providing sufficient mass for heat absorption. Thermal imaging shows uniform temperature distribution across the entire surface area.Precision-engineered 1.025" (26.03mm) creates optimal boundary layer separation, enhancing convective heat transfer. This parameter is particularly crucial for natural convection cooling scenarios.Validated through wind tunnel testing, the 0.50°C/W @ 500 LFM performance exceeds industry benchmarks for similar form factors. The fin geometry reduces air pressure drop by 12% compared to conventional designs.The Aluminum Alloy construction provides an ideal balance between thermal conductivity (180 W/m K) and weight considerations. For extreme environments, copper variants are available with optional nickel plating.
Product Attributes
- Product Status: Active
- Type: Top Mount, Extrusion
- Package Cooled: -
- Attachment Method: Adhesive
- Shape: Rectangular, Fins
- Length: 60.000" (1524.00mm)
- Width: 4.235" (107.57mm)
- Diameter: -
- Fin Height: 1.025" (26.03mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 0.50°C/W @ 500 LFM
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: -
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