73780-1257
Molex
73780-1257
Molex
HDM DC STKG MOD ST3.5 30 SAU 144
Reference Price (USD)
1+
$38.73000
500+
$38.3427
1000+
$37.9554
1500+
$37.5681
2000+
$37.1808
2500+
$36.7935
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
73780-1257
$38.73
Product details
The 73780-1257 by Molex revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Specifically developed for Daughtercard implementations, this series excels in co-packaged optics interconnect applications.Featuring Receptacle, Female Sockets configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.The HDM design incorporates advanced crosstalk suppression techniques, critical for maintaining eye diagram integrity in high-speed serial links.With 144 available positions, this solution enables unprecedented port density for top-of-rack switching equipment.The All loaded variant offers power-efficient solutions for partial population scenarios in server backplanes.The 0.079" (2.00mm) micro-pitch design enables breakthrough density while maintaining impedance control for 112G SerDes channels.6 row configuration supports orthogonal direct-attach copper architectures in disaggregated server designs.The 24 column architecture enables efficient routing of wide parallel buses in memory-centric computing systems.Through Hole installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.The Solder process has been optimized for low-void solder joints in mass reflow processes per IPC-7095C standards.Key Stackable include integrated heat spreaders and airflow-optimized housings for thermal management in high-performance computing applications.Gold plating technology provides superior wear resistance exceeding 10,000 mating cycles for data center hot-swap scenarios.30.0µin (0.76µm) coating thickness ensures compliance with IEC 60512-99-001 fretting corrosion requirements.The Black housing material incorporates laser-markable surfaces for traceability in automated manufacturing environments.
Product Attributes
- Product Status: Active
- Connector Usage: Daughtercard
- Connector Type: Receptacle, Female Sockets
- Connector Style: HDM
- Number of Positions: 144
- Number of Positions Loaded: All
- Pitch: 0.079" (2.00mm)
- Number of Rows: 6
- Number of Columns: 24
- Mounting Type: Through Hole
- Termination: Solder
- Contact Layout, Typical: -
- Features: Stackable
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Black
You May Also Be Interested In
