7-1542006-8
TE Connectivity AMP Connectors
7-1542006-8
TE Connectivity AMP Connectors
HEAT SINK BGA 29MM 7FIN RADIAL
Reference Price (USD)
1+
$13.24361
500+
$13.1111739
1000+
$12.9787378
1500+
$12.8463017
2000+
$12.7138656
2500+
$12.5814295
Exquisite packaging
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7-1542006-8
$13.24
Product details
TE Connectivity AMP Connectors's 7-1542006-8 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.Optimized for LGA 4677 sockets, the solution manages {Power Dissipation @ Temperature Rise} at server inlet temperatures up to 45 C. The thermal interface maintains performance through 50,000 insertion cycles.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.For cylindrical heat pipes, the 2.000" (50.80mm) OD variant offers 6mm and 8mm options. The design maintains capillary performance at 45 tilt angles common in rack-mounted servers.Precision 0.892" (22.65mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).The 1.50°C/W @ 400 LFM performance is validated under ASHRAE TC9.9 Class A3 conditions. The design maintains stability at airflow rates from 10-25 CFM.Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.Nickel-plated surface ensures long-term reliability in data center environments. The finish resists sulfurization and maintains emissivity >0.85 after 5 years of operation.
Product Attributes
- Product Status: Active
- Type: -
- Package Cooled: BGA
- Attachment Method: Clip
- Shape: Cylindrical
- Length: -
- Width: -
- Diameter: 2.000" (50.80mm) OD
- Fin Height: 0.892" (22.65mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 400 LFM
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: Black Anodized
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