7-1542006-4
TE Connectivity AMP Connectors
7-1542006-4
TE Connectivity AMP Connectors
25MM HS ASSY ULTEM CL
Reference Price (USD)
1+
$9.91405
500+
$9.8149095
1000+
$9.715769
1500+
$9.6166285
2000+
$9.517488
2500+
$9.4183475
Exquisite packaging
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7-1542006-4
$9.91
Product details
TE Connectivity AMP Connectors's 7-1542006-4 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.Optimized for LGA 4677 sockets, the solution manages {Power Dissipation @ Temperature Rise} at server inlet temperatures up to 45 C. The thermal interface maintains performance through 50,000 insertion cycles.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.For cylindrical heat pipes, the 1.375" (34.92mm) OD variant offers 6mm and 8mm options. The design maintains capillary performance at 45 tilt angles common in rack-mounted servers.Precision 0.442" (11.23mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).The 5.99°C/W @ 200 LFM performance is validated under ASHRAE TC9.9 Class A3 conditions. The design maintains stability at airflow rates from 10-25 CFM.The 13.20°C/W specification enables emergency operation during cooling system failures. The design maintains processors below 90 C for 15 minutes without airflow.Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.Nickel-plated surface ensures long-term reliability in data center environments. The finish resists sulfurization and maintains emissivity >0.85 after 5 years of operation.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Clip
- Shape: Cylindrical
- Length: -
- Width: -
- Diameter: 1.375" (34.92mm) OD
- Fin Height: 0.442" (11.23mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 5.99°C/W @ 200 LFM
- Thermal Resistance @ Natural: 13.20°C/W
- Material: Aluminum
- Material Finish: Black Anodized
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