66741-5

TE Connectivity Aerospace, Defense and Marine's 66741-5 sets new standards in Contacts - Multi Purpose for 5G infrastructure applications. This high-performance interconnect solution combines innovative materials science with precision manufacturing to deliver exceptional RF characteristics.The Power, Stamped architecture incorporates quad-shielded isolation, reducing crosstalk by 40dB compared to conventional designs in millimeter-wave applications.Precision-machined Socket interfaces maintain impedance control within 1 , critical for maintaining signal integrity in high-speed data transmission.Engineered with Crimp technology, the contacts demonstrate 25% lower insertion force while maintaining IEC 60512-100-12 compliant retention force.Supporting 10 AWG wiring configurations, the design facilitates both power delivery and high-frequency signal routing in compact base station equipment.Copper selection provides optimal spring characteristics for maintaining contact force over extended thermal cycling (-55 C to +125 C).The Gold surface treatment achieves <5m contact resistance, meeting stringent requirements for low-voltage power distribution systems.Precision-controlled 30.0µin (0.76µm) deposition ensures consistent RF performance across production batches for phased array antenna applications.