66493-3

TE Connectivity AMP Connectors's 66493-3 redefines D-Sub, D-Shaped Connectors - Contacts technology for quantum computing applications. These ultra-precision contacts maintain signal integrity at cryogenic temperatures while minimizing thermal conductivity.Specialized for Signal quantum bit control systems, the contacts demonstrate <0.1dB insertion loss at 4K temperatures. Comparative testing shows 50% lower thermal load than conventional cryogenic interconnects.The Female Socket configuration utilizes superconducting materials for near-zero resistance. The patented geometry achieves <10n contact resistance at 10mA bias current.Cryo-optimized Stamped technology prevents microphonic noise generation. Each contact undergoes helium leak testing to verify <10^-9 mbar l/s leak rates.Engineered for 22-28 AWG superconducting wiring, the contacts maintain mechanical stability during thermal contraction. Testing confirms <0.01% dimensional change from 300K to 4K.Crimp methods are validated for dilution refrigerator environments. The indium-based system demonstrates 1000+ reliable thermal cycles without performance degradation.Selected Phosphor Bronze composition exhibits near-zero magnetoresistance. Material characterization confirms <1ppm magnetic susceptibility at 10T fields.The Gold surface treatment prevents oxidation in ultra-high vacuum. Auger electron spectroscopy confirms <5 oxide layer after 1000 hours at 10^-10 Torr.With 30.0µin (0.76µm) deposition, the contacts achieve stable thermal emf characteristics. Testing shows <0.1 V/K thermal voltage at cryogenic temperatures.Gold plating provides excellent bonding for superconducting joints. The finish composition enables critical current densities exceeding 10^5 A/cm .Atomic-level controlled Flash ensures consistent performance across quantum arrays. Statistical analysis shows <1% variation in contact properties across 1000 units.The 22 geometry supports high-density qubit addressing with 50 m pitch capability. Cryogenic SEM imaging confirms zero mechanical deformation at 4K operating temperatures.The High Density (HD), Insulation Support integration minimizes parasitic capacitance in qubit control lines. Network analyzer measurements confirm <0.1pF stray capacitance at 10GHz.