6600112-5
TE Connectivity AMP Connectors
6600112-5
TE Connectivity AMP Connectors
CONN HEADER MULTI-BEAM 28POS PCB
Reference Price (USD)
1+
$7.83000
500+
$7.7517
1000+
$7.6734
1500+
$7.5951
2000+
$7.5168
2500+
$7.4385
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
6600112-5
$7.83
Product details
The 6600112-5 by TE Connectivity AMP Connectors revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Featuring Header, Male Pins and Blades configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.The Multi-Beam design incorporates advanced crosstalk suppression techniques, critical for maintaining eye diagram integrity in high-speed serial links.With 28 available positions, this solution enables unprecedented port density for top-of-rack switching equipment.The All loaded variant offers power-efficient solutions for partial population scenarios in server backplanes.The 0.100" (2.54mm) micro-pitch design enables breakthrough density while maintaining impedance control for 112G SerDes channels.4 row configuration supports orthogonal direct-attach copper architectures in disaggregated server designs.Through Hole, Right Angle installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.The Solder process has been optimized for low-void solder joints in mass reflow processes per IPC-7095C standards.The 16 Signal, 12 Power arrangement implements optimized return current paths essential for reducing simultaneous switching noise in AI accelerator cards.Key Mating Guide include integrated heat spreaders and airflow-optimized housings for thermal management in high-performance computing applications.Gold plating technology provides superior wear resistance exceeding 10,000 mating cycles for data center hot-swap scenarios.30.0µin (0.76µm) coating thickness ensures compliance with IEC 60512-99-001 fretting corrosion requirements.
Product Attributes
- Product Status: Obsolete
- Connector Usage: -
- Connector Type: Header, Male Pins and Blades
- Connector Style: Multi-Beam
- Number of Positions: 28
- Number of Positions Loaded: All
- Pitch: 0.100" (2.54mm)
- Number of Rows: 4
- Number of Columns: -
- Mounting Type: Through Hole, Right Angle
- Termination: Solder
- Contact Layout, Typical: 16 Signal, 12 Power
- Features: Mating Guide
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: -
You May Also Be Interested In
