6469002-1
TE Connectivity AMP Connectors
6469002-1
TE Connectivity AMP Connectors
CONN HDR HIGH SPEED 120POS PCB
Reference Price (USD)
1+
$17.06000
500+
$16.8894
1000+
$16.7188
1500+
$16.5482
2000+
$16.3776
2500+
$16.207
Exquisite packaging
Discount
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6469002-1
$17.06
Product details
The 6469002-1 from TE Connectivity AMP Connectors represents a cutting-edge solution in Backplane Connectors - Specialized, engineered for high-density backplane applications requiring exceptional signal integrity. This advanced connector system combines robust construction with precision engineering to deliver reliable performance in mission-critical environments.Designed specifically for Backplane applications, this product series delivers proven performance in high-speed digital systems up to 56Gbps NRZ.With Header, Male Pins and Blades configuration, this component ensures optimal mating compatibility while maintaining superior electrical characteristics. The hermaphroditic contact design enhances assembly flexibility in complex systems.Featuring High Speed technology, the connector achieves industry-leading contact reliability, particularly beneficial for high-vibration environments found in industrial automation equipment.The 120 position count provides exceptional scalability for backplane architectures, enabling designers to implement modular system designs with simplified interconnect schemes.When configured with All loaded positions, the connector offers customizable solutions for power distribution networks without compromising signal path density.With 0.098" (2.50mm) centerline spacing, the design achieves optimal balance between high-density packaging and manufacturability requirements.The 8 row configuration enables three-dimensional backplane stacking, particularly valuable in data center orthogonal interconnect architectures.The 10 column arrangement supports wide bus architectures while maintaining controlled impedance characteristics across all signal paths.The Through Hole mounting option facilitates both standard and high-reliability PCB attachment methods, with proven performance in through-hole reflow processes.Press-Fit methods provide flexibility for both automated assembly processes and field-serviceable connections in telecom infrastructure.The 80 Single Signal, 40 Ground arrangement optimizes impedance matching while providing balanced power delivery - crucial for maintaining signal integrity in 5G base station applications.Gold plating ensures durable contact surfaces capable of withstanding multiple mating cycles, meeting MIL-STD-202H standards for harsh environment operation.The 30.0µin (0.76µm) coating thickness exceeds industry standards for corrosion resistance, ensuring long-term reliability in humid operating conditions.
Product Attributes
- Product Status: Active
- Connector Usage: Backplane
- Connector Type: Header, Male Pins and Blades
- Connector Style: High Speed
- Number of Positions: 120
- Number of Positions Loaded: All
- Pitch: 0.098" (2.50mm)
- Number of Rows: 8
- Number of Columns: 10
- Mounting Type: Through Hole
- Termination: Press-Fit
- Contact Layout, Typical: 80 Single Signal, 40 Ground
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: -
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