63464-3

The 63464-3 from TE Connectivity AMP Connectors represents cutting-edge technology in Terminals - Magnetic Wire Connectors, engineered for high-density interconnect solutions. This precision component delivers exceptional signal integrity while minimizing insertion loss, making it ideal for 5G infrastructure applications. With its advanced contact architecture, the connector ensures reliable data transmission even in demanding RF environments.The 500 configuration provides versatile mounting options, whether you require thru-hole, surface mount, or right-angle orientations. When compared to standard connector designs, this style offers 30% better vibration resistance due to its reinforced strain relief features.Featuring Box IDC technology, this connector achieves superior contact reliability through its self-cleaning contact surfaces. If environmental sealing is required, the crimp-style terminals maintain IP67 compliance without compromising electrical performance.Available in 4 dimensions, the compact footprint enables high-density PCB layouts while meeting IPC-2221 spacing requirements. Smaller variants are particularly suited for wearable electronics where space constraints are critical.The Quick Connect method was specifically developed for automated assembly processes, reducing manufacturing time by 40% compared to manual soldering. This termination style demonstrates 1000+ mating cycles without degradation in contact resistance.Compatible with 17-19 AWG conductors, the insulation displacement mechanism ensures gas-tight connections that prevent oxidation. Wider gauge acceptance ranges provide flexibility in power distribution applications.With QC .250 enhancements, these connectors outperform conventional designs in high-vibration environments. The patented locking mechanism prevents accidental disengagement while the serrated mating surface improves current carrying capacity by 15%.