628-65ABT5
Wakefield-Vette
628-65ABT5
Wakefield-Vette
HEATSINK CPU 43MM SQ BLK H=.65"
Reference Price (USD)
1+
$1.96097
500+
$1.9413603
1000+
$1.9217506
1500+
$1.9021409
2000+
$1.8825312
2500+
$1.8629215
Exquisite packaging
Discount
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628-65ABT5
$1.96
Product details
Optimized for automotive electronics, the 628-65ABT5 by Wakefield-Vette sets new standards in Thermal - Heat Sinks reliability. This AEC-Q200 qualified thermal solution addresses unique challenges in electric vehicle power systems, combining robust construction with exceptional thermal performance.The Top Mount Skived design provides precise flatness ( 0.05mm/m ) required for automotive power modules. The manufacturing process eliminates internal stresses that could lead to micro-cracking in vibration environments.Specifically engineered for IGBT and TE0600 packages, the solution manages {Power Dissipation @ Temperature Rise} under hood temperatures reaching 125 C. The thermal interface maintains integrity across 1000+ thermal shock cycles (-40 C to +150 C).The Bolt On system meets automotive vibration requirements (ISO 16750-3) while allowing for serviceability. The titanium hardware resists galvanic corrosion in wet environments.Square Pin Fins configuration delivers {Thermal Resistance @ Forced Air Flow} in turbulent underhood airflow. The staggered pin arrangement reduces boundary layer thickness by 18% compared to linear fins.The 1.750" (44.45mm) dimension accommodates standard automotive ECU footprints. Crash simulations confirm the design withstands 50g impacts without compromising thermal contact.With 1.700" (43.18mm) coverage, the solution cools multiple power devices simultaneously. The copper-tungsten base plate prevents thermal runaway in parallel configurations.Optimized 0.650" (16.51mm) ensures compatibility with confined spaces in electric vehicle battery management systems. The design prevents fin resonance at common engine vibration frequencies.Rated for 3.0W @ 20°C in 85 C ambient conditions, the design includes 20% margin for overload conditions. Thermal simulations account for solar loading in vehicle applications.The 2.00°C/W @ 400 LFM performance is validated under pulsating airflow conditions simulating real-world driving scenarios. The design maintains stability at airflow angles up to 30 off-axis.High-conductivity Copper ( 390 W/m K) with nickel-plated finish resists automotive fluids. The material selection meets GMW3097 chemical resistance requirements.Natural Anodized surface provides excellent emissivity ( 0.85) for radiative cooling. The finish is resistant to road salt and brake fluid exposure.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Pin Fins
- Length: 1.750" (44.45mm)
- Width: 1.700" (43.18mm)
- Diameter: -
- Fin Height: 0.650" (16.51mm)
- Power Dissipation @ Temperature Rise: 3.0W @ 20°C
- Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: Black Anodized
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