61124-350CACLF

The 61124-350CACLF from Amphenol ICC (FCI) delivers military-grade reliability for Memory Connectors - PC Card Sockets applications in aerospace and defense systems. Engineered to meet MIL-STD-810 standards, this connector maintains signal integrity in extreme environmental conditions.Supporting PCMCIA - Type I, II, III formats, the connector enables secure data transfer in avionics systems. Its tamper-resistant design meets stringent requirements for classified information handling.The 68, 68 contact array has been radiation-hardened for space applications. Each contact is individually tested to ensure performance in high-vacuum conditions.The Stacked Connector and Ejector design incorporates hermetic sealing for operation in pressurized aircraft cabins. The connector maintains performance from -55 C to 125 C without degradation.With Push In, Push Out operation, the connector enables quick module replacement in field conditions. The positive engagement mechanism provides audible confirmation of proper mating.The Left configuration has been optimized for operation with gloved hands. The oversized ejector lever functions reliably in -40 C conditions.The Card Edge Header variant features corrosion-resistant mounting hardware suitable for naval applications. All metallic components are treated to resist salt fog per MIL-STD-883.The Card Guides include EMI/RFI shielding that exceeds MIL-STD-461 requirements. The multi-layer shielding approach provides 360 protection against electromagnetic interference.The 0.654" (16.60mm) ultra-low profile meets strict height constraints in airborne electronics. The design maintains structural integrity under 15G vibration loads.Available in Normal, Standard - Top configurations, the connector supports both chassis and PCB mounting. The reverse-mount option is particularly useful in stacked avionics modules.The Gold plating has been qualified for 1,000 mating cycles in sandy environments. This ruggedized surface treatment prevents particulate-induced contact wear.With 30.0µin (0.76µm) gold plating, the contacts maintain stable resistance through thermal cycling. The plating process has been certified to NASA outgassing standards.