61-08-0909-HCS10G
Parker Chomerics
61-08-0909-HCS10G
Parker Chomerics
THERM-A-GAP HCS10G 9X9X0.080"
Reference Price (USD)
1+
$71.97000
500+
$71.2503
1000+
$70.5306
1500+
$69.8109
2000+
$69.0912
2500+
$68.3715
Exquisite packaging
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Product details
Parker Chomerics's 61-08-0909-HCS10G establishes new standards in Thermal - Pads, Sheets for renewable energy systems. This high-efficiency thermal solution is engineered specifically for solar inverters and wind turbine power electronics, delivering unmatched reliability in green energy applications.As an environmentally certified Gap Filler Pad, Sheet, this product combines superior thermal transfer with RoHS-compliant materials. The halogen-free composition makes it ideal for sustainable energy applications requiring eco-friendly components.Available in Square configurations, this solution accommodates large-area power modules. The precision-cut profiles ensure optimal coverage of IGBT and MOSFET packages in high-power converters.With 228.60mm x 228.60mm dimensions, this thermal pad fits standard renewable energy enclosure designs. The optimized footprint allows for efficient thermal pathway creation in space-constrained power cabinets.The carefully engineered 0.0800" (2.032mm) provides perfect balance between thermal transfer and vibration damping. This characteristic is particularly valuable in wind turbine applications subject to constant mechanical stress.Constructed from weather-resistant Silicone, this pad exhibits exceptional performance in humid environments. The hydrophobic formulation prevents moisture absorption that could degrade thermal performance.The rugged Fiberglass provides excellent handling characteristics in field installations. This reinforced backing prevents tearing during manual application in challenging outdoor conditions.The Orange identification system facilitates quick material verification during field maintenance. This outdoor-visible coloring remains legible even after years of environmental exposure.Achieving 1.0W/m-K performance, this material enables more efficient cooling of power semiconductors. The isotropic properties ensure uniform heat distribution across large-area devices.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 228.60mm x 228.60mm
- Thickness: 0.0800" (2.032mm)
- Material: Silicone
- Adhesive: -
- Backing, Carrier: Fiberglass
- Color: Orange
- Thermal Resistivity: -
- Thermal Conductivity: 1.0W/m-K