6059632-1
TE Connectivity AMP Connectors
6059632-1
TE Connectivity AMP Connectors
CONN MINI OSP RCPT STR 50 OHM
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Product details
The 6059632-1 from TE Connectivity AMP Connectors sets new benchmarks in Coaxial Connectors (RF) performance for satellite payload systems. Designed for GEO orbit conditions, this connector maintains flawless signal integrity through 15+ years of continuous operation in the space environment.Featuring OSP, Mini configuration, the connector achieves <0.001dB/mate insertion loss variation after 500 thermal cycles. The radiation-hardened dielectric prevents total dose effects up to 100kRad.With Receptacle, Male Pin architecture, the connector exhibits <1pA leakage current in vacuum. The molecular barrier coating prevents outgassing contamination of sensitive optics.Solder technology ensures stable contact resistance despite atomic oxygen exposure. The gold-iridium alloy contacts withstand >10,000 thermal cycles in LEO conditions.The Solder system provides >100dB EMI shielding against solar flare events. The multi-foil design meets MIL-STD-188-164 requirements for spacecraft bonding.Precision-controlled 50Ohm maintains <0.5% deviation across -150 C to +125 C. The compensated dielectric design accounts for thermal expansion in vacuum.Designed for Panel Mount, Threaded installation, the connector withstands 50G vibration during launch. The titanium housing provides >98% radiation shielding effectiveness.The Snap-On mechanism provides positive engagement with <5N m torque in zero-G. The captive hardware meets NASA-STD-8739.4 requirements.Characterized at 18 GHz, the connector shows <0.05dB PIM in high-power RF applications. The multipaction-resistant design handles 5kW peak power at altitude.With 1 isolated channels, the connector supports redundant spacecraft systems. Each port features individual radiation-hardened ESD protection.Hermetically Sealed include integrated thermistors for thermal gradient monitoring. The connector is qualified per ESA ECSS standards for Ariane 6 launch vehicles.The Silver anodization provides <5% solar absorptance in AM0 conditions. The optical properties remain stable under UV and proton radiation.The Beryllium Copper formulation resists cold welding in vacuum with <10mg contact force. The beryllium-copper alloy maintains spring properties at cryogenic temperatures.
Product Attributes
- Product Status: Obsolete
- Connector Style: OSP, Mini
- Connector Type: Receptacle, Male Pin
- Contact Termination: Solder
- Shield Termination: Solder
- Impedance: 50Ohm
- Mounting Type: Panel Mount, Threaded
- Mounting Feature: -
- Cable Group: -
- Fastening Type: Snap-On
- Frequency - Max: 18 GHz
- Number of Ports: 1
- Features: Hermetically Sealed
- Housing Color: Silver
- Ingress Protection: -
- Center Contact Material: Beryllium Copper
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