6059503-1
TE Connectivity AMP Connectors
6059503-1
TE Connectivity AMP Connectors
CONN MINI OSP JACK STR 50 OHM
Reference Price (USD)
1+
$128.27900
500+
$126.99621
1000+
$125.71342
1500+
$124.43063
2000+
$123.14784
2500+
$121.86505
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
6059503-1
$128.28
Product details
Optimized for next-generation networks, TE Connectivity AMP Connectors's 6059503-1 delivers breakthrough performance in Coaxial Connectors (RF) applications. This innovative solution combines millimeter-wave readiness with robust mechanical design for 5G infrastructure deployment.The OSP, Mini interface features patented dielectric loading for enhanced mode suppression. Comparative testing shows 30% better TE11 mode rejection than conventional designs.With Jack, Female Socket configuration, the connector achieves VSWR <1.15:1 up to {Frequency - Max}. The elliptical interface design minimizes higher-order mode generation.Solder technology provides cold weld equivalent performance without special tools. The diffusion-barrier plating ensures stable contact resistance over 10,000 cycles.The Solder system delivers <0.5 ground path resistance up to 40GHz. The multi-point contact design eliminates ground loops in phased array systems.Precision 50Ohm control is maintained through compensated dielectric geometry. Full-wave simulation confirms <2% impedance variation across the operating band.Designed for Panel Mount installation, the connector features integrated torque indication for proper mating force. The anti-rotation design prevents cable twisting during operation.Bulkhead - Front Side Nut design enables tool-less panel installation in <15 seconds. The floating contact design compensates for 0.5mm panel misalignment.Validated with RG-405 (.085" Semi Rigid) cables, the connector maintains phase tracking within 2 across temperature extremes. The strain relief system exceeds GR-487 seismic requirements.The Snap-On mechanism provides positive engagement with <180 rotation. The self-cleaning contacts remove oxide buildup during mating cycles.Characterized at 18 GHz, the connector exhibits insertion loss <0.1dB/inch at 30GHz. The low-loss dielectric material minimizes group delay distortion.With 1 individually shielded channels, the connector supports massive MIMO configurations. Each port features integrated ESD protection to 15kV.The Silver housing incorporates conductive additives for enhanced EMI shielding. Material properties are verified per UL 94V-0 flammability standards.The Beryllium Copper formulation provides excellent stress relaxation resistance. Contact force remains >100g after 50,000 mating cycles per EIA-364-09.
Product Attributes
- Product Status: Active
- Connector Style: OSP, Mini
- Connector Type: Jack, Female Socket
- Contact Termination: Solder
- Shield Termination: Solder
- Impedance: 50Ohm
- Mounting Type: Panel Mount
- Mounting Feature: Bulkhead - Front Side Nut
- Cable Group: RG-405 (.085" Semi Rigid)
- Fastening Type: Snap-On
- Frequency - Max: 18 GHz
- Number of Ports: 1
- Features: -
- Housing Color: Silver
- Ingress Protection: -
- Center Contact Material: Beryllium Copper
You May Also Be Interested In