6-5175474-2
TE Connectivity AMP Connectors
6-5175474-2
TE Connectivity AMP Connectors
CONN BTB HD RCPT 130POS R/A SLDR
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Product details
TE Connectivity AMP Connectors's 6-5175474-2 revolutionizes D-Shaped Connectors - Centronics technology for aerospace and defense applications. This MIL-DTL-24308 compliant connector system combines lightweight construction with exceptional durability, meeting the stringent requirements of avionics and satellite communications systems.The Outer Shroud Contacts configuration implements quad-redundant contact points that exceed MIL-STD-1344 vibration requirements for launch vehicle applications.Available in Receptacle variants, these connectors maintain signal integrity through 50G shock pulses and 20-2000Hz random vibration profiles.With 130 contacts in compact form factor, this series enables 40% weight reduction in airborne electronics compared to traditional circular connectors.The 2 row arrangement incorporates embedded optical channels for hybrid electrical/optical signal transmission in next-gen avionics.Through Hole, Right Angle options include composite-friendly designs that prevent galvanic corrosion in aluminum-carbon fiber structures.Utilizing Solder methods, these connectors achieve outgassing levels below 0.1% TML/0.01% CVCM for space applications per NASA-STD-6016.As a Board to Board, High Density specialist, this series implements radiation-hardened materials that withstand 100kRad TID for satellite payload interfaces.Key Board Lock include quick-disconnect mechanisms and anti-FOD designs required in flight-critical systems.Gold plating maintains contact resistance stability through 500 thermal cycles from -65 C to +175 C per MIL-STD-810H.Precision 30.0µin (0.76µm) control ensures reliable operation in atomic oxygen environments encountered in LEO spacecraft.
Product Attributes
- Product Status: Obsolete
- Connector Style: Outer Shroud Contacts
- Connector Type: Receptacle
- Number of Positions: 130
- Number of Rows: 2
- Mounting Type: Through Hole, Right Angle
- Termination: Solder
- Flange Feature: -
- Type: Board to Board, High Density
- Features: Board Lock
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
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