6-1460822-1
TE Connectivity AMP Connectors
6-1460822-1
TE Connectivity AMP Connectors
CONN 1.0/2.3 JACK R/A 75 OHM PCB
Reference Price (USD)
1+
$48.04451
500+
$47.5640649
1000+
$47.0836198
1500+
$46.6031747
2000+
$46.1227296
2500+
$45.6422845
Exquisite packaging
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6-1460822-1
$48.04
Product details
TE Connectivity AMP Connectors's 6-1460822-1 revolutionizes Coaxial Connectors (RF) connectivity for terahertz imaging systems. Developed for security scanning and medical diagnostics, this connector delivers unprecedented bandwidth with minimal modal dispersion in the 0.1-10THz spectrum.The 1.0/2.3 interface features photonic crystal fiber alignment for optimal Gaussian beam coupling. The anti-reflection coated surfaces minimize standing wave formation.Utilizing Jack, Female Socket topology, the connector achieves <0.01dB/mm attenuation at 1THz. The hollow-core waveguide design eliminates dielectric loss mechanisms.Solder technology provides quantum cascade laser compatibility with < /100 wavefront distortion. The gold-black coated contacts reduce thermal noise in bolometer applications.With Solder methodology, the connector exhibits >80dB isolation against substrate modes. The corrugated horn design ensures pure HE11 mode propagation.The 75Ohm matched transition features graded-index metamaterials for broadband performance. Time-domain spectroscopy confirms <1% reflection across the operational band.Optimized for Panel Mount, Through Hole, Right Angle integration, the connector maintains <5 m alignment tolerance. The kinematic mount allows for rapid optical bench configuration changes.Engineered with Bulkhead - Front Side Nut, the connector withstands 100G shock loads without misalignment. The invar-based construction minimizes thermal drift.The Push-Pull mechanism provides sub-wavelength positional accuracy with <1 m repeatability. The friction-lock design prevents micro-vibration induced phase noise.Characterized at 8 GHz, the connector shows <0.5dB insertion loss up to 5THz. The surface plasmon-enhanced design minimizes conductor losses.With 2 independent channels, the connector supports multi-spectral imaging arrays. Each port features integrated beam collimation optics.The Silver housing material exhibits <0.001 absorption coefficient at THz frequencies. The diamond-turned surface finish minimizes scattering losses.The Beryllium Copper formulation provides <10nm RMS surface roughness. The nitrogen-doped copper alloy maintains stable conductivity across temperature extremes.
Product Attributes
- Product Status: Active
- Connector Style: 1.0/2.3
- Connector Type: Jack, Female Socket
- Contact Termination: Solder
- Shield Termination: Solder
- Impedance: 75Ohm
- Mounting Type: Panel Mount, Through Hole, Right Angle
- Mounting Feature: Bulkhead - Front Side Nut
- Cable Group: -
- Fastening Type: Push-Pull
- Frequency - Max: 8 GHz
- Number of Ports: 2
- Features: -
- Housing Color: Silver
- Ingress Protection: -
- Center Contact Material: Beryllium Copper
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