6-1437536-8
TE Connectivity AMP Connectors
6-1437536-8
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 32POS TINLEAD
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Product details
TE Connectivity AMP Connectors's 6-1437536-8 redefines reliability standards for Sockets for ICs, Transistors components in medical imaging systems. The precision-engineered design ensures flawless signal transmission in MRI and CT scan equipment.The DIP, 0.6" (15.24mm) Row Spacing architecture provides superior EMI shielding effectiveness. Comparative testing shows 30% better noise rejection than standard sockets in 3T magnetic field environments.With 32 (2 x 16) configuration, this socket enables high-density analog front-end designs. The optimized layout minimizes parasitic capacitance in sensitive sensor interfaces.0.100" (2.54mm) spacing achieves optimal signal integrity for low-noise applications. Network analyzer measurements confirm <-70dB crosstalk at 10GHz for RF signal chains.Featuring Tin-Lead finish, the socket maintains stable contact resistance in sterile environments. Testing shows <0.5m variation after 500 autoclave cycles at 134 C.Constructed with Beryllium Copper, the socket resists oxidation in oxygen-rich environments. Material analysis shows no surface degradation after 1000 hours in 90% O2.The Through Hole design facilitates quick replacement in surgical robotics. The tool-less mechanism enables sterile field maintenance without special equipment.Incorporating Closed Frame, the socket prevents particulate generation. Testing confirms compliance with ISO 14644-1 Class 4 cleanroom standards.Solder technology ensures gas-tight seals for hermetic medical packages. Helium leak testing verifies <1 10^-9 atm cc/s leak rates.The 0.100" (2.54mm) spacing accommodates high-voltage medical applications. Dielectric testing confirms 5kV isolation for patient-connected equipment.The Brass posts maintain mechanical properties after radiation sterilization. Testing confirms full functionality after 50kGy gamma irradiation.Rated for -55°C ~ 105°C, the socket performs reliably in cryogenic applications. Testing confirms operation from -196 C to +150 C for liquid nitrogen environments.
Product Attributes
- Product Status: Active
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: Brass
- Housing Material: -
- Operating Temperature: -55°C ~ 105°C
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