5916657-2
TE Connectivity AMP Connectors
5916657-2
TE Connectivity AMP Connectors
CONN SOCKET PGA ZIF 321POS GOLD
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Product details
The 5916657-2 from TE Connectivity AMP Connectors delivers military-grade performance for Sockets for ICs, Transistors applications in defense systems. Designed to exceed MIL-STD-883 requirements, this socket ensures mission success in extreme conditions.Featuring PGA, ZIF (ZIP) configuration, the socket provides EMP protection for sensitive electronics. Testing confirms survivability in 50kV/m transient electromagnetic fields.With 321 (19 x 19), the socket supports ruggedized avionics designs. The reinforced grid pattern withstands 100G mechanical shock per MIL-STD-810H.0.100" (2.54mm) spacing maintains signal integrity in jamming environments. Testing shows <-65dB crosstalk despite intentional RF interference.The Gold finish resists corrosion in salt fog. Testing per MIL-STD-202G Method 101 shows no degradation after 1000 hours.30.0µin (0.76µm) thickness ensures long-term reliability. Accelerated life testing predicts 20-year service in naval applications.Constructed with Copper Alloy, the socket withstands ballistic impacts. Testing confirms functionality after 30g 11ms half-sine shock pulses.The Through Hole design prevents loosening in vibration. Testing per MIL-STD-167-1 shows zero connection loss at 29Hz-2kHz random vibration.Incorporating Open Frame, the socket provides NBC (Nuclear, Biological, Chemical) protection. Sealing tests confirm operation after immersion in decontamination solutions.Solder technology ensures reliability in high-altitude conditions. Testing confirms operation at 70,000 feet with <1% contact resistance change.The 0.100" (2.54mm) spacing accommodates armored cable terminations. Mechanical testing confirms 500N pull-out resistance for field-replaceable connections.Gold plating prevents galvanic corrosion. Testing in marine environments shows no measurable degradation after 5 years.The 30.0µin (0.76µm) finish ensures reliability after sand abrasion. Testing per MIL-STD-810G Method 510.5 shows <5% contact resistance change.The Copper Alloy posts resist stress corrosion cracking. Testing per ASTM G36 shows no cracking after 1000 hours in boiling MgCl2.Thermoplastic housing material provides radar absorption. Testing shows -20dB RCS reduction compared to metal housings.
Product Attributes
- Product Status: Obsolete
- Type: PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid): 321 (19 x 19)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Thermoplastic
- Operating Temperature: -
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