5822030-4
TE Connectivity AMP Connectors
5822030-4
TE Connectivity AMP Connectors
CONN SKT SIMM 80POS PCB
Reference Price (USD)
1+
$6.10000
500+
$6.039
1000+
$5.978
1500+
$5.917
2000+
$5.856
2500+
$5.795
Exquisite packaging
Discount
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5822030-4
$6.10
Product details
TE Connectivity AMP Connectors introduces the 5822030-4, a breakthrough Memory Connectors - Inline Module Sockets solution for quantum computing applications. This cryogenic-ready connector enables reliable operation at milli-Kelvin temperatures for qubit control systems.Quantum-optimized SIMM architecture minimizes thermal conductivity while maintaining 50 impedance matching at 4K temperatures.The 80 configuration supports microwave signal distribution with <0.01dB crosstalk at 10GHz, critical for superconducting qubit control.Designed for RAM compatibility, the connector exhibits <1fA leakage current at 10mK for error-free quantum error correction circuits.Beyond MO-116 requirements, the design passes 1000+ thermal shock cycles between 300K and 4K without mechanical failure.The Through Hole implementation utilizes non-magnetic materials with <1ppm/K thermal expansion coefficient matching for dilution refrigerator installations.Specialized Board Guide, Latches include superconducting RF filters that suppress noise above 60dB in the 5-8GHz qubit operating band.Normal, Standard - Top configuration enables vertical integration with quantum processor packages while minimizing vibrational coupling.Cryogenic Tin maintains <5m contact resistance at 4K temperatures with zero thermoelectric voltage generation.Atomic-layer-deposited 200.0µin (5.08µm) coating prevents oxidation while ensuring consistent performance during repeated thermal cycling.
Product Attributes
- Product Status: Active
- Connector Style: SIMM
- Number of Positions: 80
- Memory Type: RAM
- Standards: MO-116
- Mounting Type: Through Hole
- Features: Board Guide, Latches
- Mounting Feature: Normal, Standard - Top
- Contact Finish: Tin
- Contact Finish Thickness: 200.0µin (5.08µm)
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