5767190-1

The 5767190-1 from TE Connectivity AMP Connectors is a high-performance Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) engineered for demanding board-to-board applications. This connector delivers exceptional signal integrity and power distribution capabilities, making it ideal for 5G base stations and high-speed computing systems. With its advanced contact technology and robust construction, it ensures reliable performance in harsh operating environments.Featuring a Plug, Outer Shroud Contacts configuration, this solution provides optimal mating stability while minimizing insertion loss. When compared to conventional designs, the patented contact geometry reduces crosstalk by up to 30%.Available in 38 contact arrangements, the connector supports flexible power delivery configurations. System designers can choose between signal-dominant or power-optimized layouts based on application requirements.The ultra-fine 0.025" (0.64mm) spacing enables high-density PCB layouts without compromising signal integrity. This precision spacing is particularly beneficial for miniaturized RF modules and compact embedded systems.With 2 rows configuration, the connector achieves balanced impedance characteristics across all channels. The symmetrical layout minimizes skew variation for high-speed differential pairs.Designed for Surface Mount installation, this connector simplifies assembly processes while maintaining mechanical robustness. The mounting system has been validated for automated pick-and-place operations.The inclusion of Board Guide, Ground Bus (Plane) enhances both reliability and manufacturability. These engineered features address common challenges in vibration-prone applications while improving ESD protection.Supporting 9mm, 18mm stacking options, the connector enables flexible system architecture designs. Engineers can optimize space utilization in multi-board systems.With 0.343" (8.70mm) profile, the connector maintains low aerodynamic interference in forced-air cooling systems. The optimized height contributes to better thermal management.