5646764-1

The 5646764-1 from TE Connectivity AMP Connectors sets the benchmark for high-density interconnect solutions in Backplane Connectors - Hard Metric, Standard. Engineered for mission-critical applications, this connector series delivers exceptional signal integrity and EMI shielding performance. With advanced contact technology, it ensures reliable data transmission in 5G infrastructure and aerospace systems where vibration resistance and low insertion loss are paramount.Featuring Header, Male Pins configuration, this interconnect solution provides superior mating stability compared to conventional designs. The precision-engineered contacts maintain consistent impedance characteristics up to 12GHz, making it ideal for high-speed digital applications.The D 22 form factor incorporates patented strain relief mechanisms that outperform standard designs by 40% in mechanical durability tests. This ruggedized construction meets MIL-STD-1344 requirements for shock and vibration environments.With 220 (176 + 44 Ground) available contact points, this connector enables complex backplane architectures while maintaining crosstalk levels below -60dB. The optimized pinout supports differential pair routing for PCIe Gen4/5 implementations.The All configuration offers design flexibility for power distribution networks. Gold-plated power contacts handle 5A continuous current with less than 10m contact resistance.The 0.079" (2.00mm) centerline spacing facilitates high-density PCB layouts without compromising manufacturability. This precision spacing reduces skew to under 5ps/inch in differential signaling applications.The 8 + 2 staggered contact arrangement improves PCB routing efficiency by 30% compared to single-row designs. This multi-row architecture supports orthogonal midplane configurations in blade server applications.Designed for Through Hole installation, this connector features reinforced solder tails that withstand 5x reflow cycles without degradation. The compliant pin design compensates for PCB warpage up to 0.3mm/m.The Press-Fit process ensures gas-tight connections with IPC Class 3 reliability. Proprietary contact geometry provides 360 wiping action for consistent contact resistance over 500 mating cycles.Optimized for Backplane applications, this interconnect system exceeds IEEE 1101.10 mechanical specifications. The guided mating system prevents misalignment in blind-mate chassis configurations.