5590H-05-1"-CIRCLE-100/PK

3M (TC)

General info

Part Number

Manufacturer

3M (TC)

Description:

THERM PAD 25.4MM DIA GRAY

Datasheet:

5590H-05-1"-CIRCLE-100/PK PDF

Reference Price (USD)

$0.73000

500+

$0.7227

1000+

$0.7154

1500+

$0.7081

2000+

$0.7008

2500+

$0.6935

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

5590H-05-1"-CIRCLE-100/PK

$0.73

Product details

3M (TC)'s 5590H-05-1"-CIRCLE-100/PK delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.As a premium Interface Pad, Sheet, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Available in precision Round configurations, this material enables optimal thermal pathway design for complex RF modules. The geometrically optimized profiles ensure maximum heat transfer efficiency.Standard 25.40mm Dia sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise 0.0197" (0.500mm) control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.The advanced Acrylic Elastomer formulation offers exceptional resistance to high-temperature aging effects. This characteristic ensures long-term reliability in continuous operation scenarios.Featuring Tacky - Both Sides properties, this solution offers reliable component bonding without outgassing concerns. This characteristic is critical for maintaining clean environments in precision RF assemblies.The Gray coding system facilitates quick material identification during assembly processes. This feature streamlines production workflows in high-mix manufacturing environments.With an exceptionally low 0.46°C/W value, this material minimizes thermal gradients across interfaces. The result is more stable operating temperatures for sensitive RF components.