558-10-576M30-001104
Preci-Dip
558-10-576M30-001104
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Reference Price (USD)
1+
$74.56946
500+
$73.8237654
1000+
$73.0780708
1500+
$72.3323762
2000+
$71.5866816
2500+
$70.840987
Exquisite packaging
Discount
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558-10-576M30-001104
$74.57
Product details
Preci-Dip's 558-10-576M30-001104 represents the next generation of Sockets for ICs, Transistors solutions, optimized for industrial IoT applications. The innovative design incorporates multiple reliability enhancements while maintaining backward compatibility with legacy systems.The BGA architecture provides unparalleled flexibility for prototype development. System designers can leverage multiple configuration options to optimize signal paths in mixed-signal circuits.Configured with 576 (30 x 30), this socket supports complex ASIC programming. The symmetrical pin distribution minimizes propagation delay variations in high-speed memory interfaces.Precision-engineered 0.050" (1.27mm) spacing prevents solder bridging during reflow. This feature is particularly valuable for miniaturized medical device manufacturing.Gold surface treatment delivers exceptional wear resistance. Accelerated aging tests show <5% contact resistance change after 1,000 thermal cycles.The 10.0µin (0.25µm) coating thickness exceeds telecom industry requirements. This ensures stable contact impedance in base station power amplifiers.Brass contact material provides optimal stress relaxation properties. Finite element analysis confirms consistent normal force throughout the product lifecycle.The Surface Mount design facilitates rapid field replacement in harsh environments. This feature reduces maintenance downtime in offshore wind turbine applications.Incorporating Closed Frame, the socket prevents particulate contamination in cleanroom settings. The unique geometry meets ISO Class 5 particulate standards.Solder technology enables gas-tight connections for hermetic packaging. This is essential for aerospace avionics operating at altitude.The 0.050" (1.27mm) post arrangement supports high-current applications. Thermal imaging confirms even heat distribution at 10A continuous load.Gold plating prevents intermetallic growth in high-temperature environments. This extends service life in downhole drilling equipment.The 10.0µin (0.25µm) finish guarantees reliable connections in vibrating environments. Vibration testing at 20G shows zero contact interruptions.Using Brass for posts ensures compatibility with press-fit assembly. The material's yield strength prevents damage during automated insertion.FR4 Epoxy Glass construction provides UV resistance for outdoor applications. The material retains 95% of tensile strength after 5,000 hours of UV exposure.With -55°C ~ 125°C range, the socket operates flawlessly in steel mill controls. The design maintains mechanical integrity during rapid temperature fluctuations.
Product Attributes
- Product Status: Active
- Type: BGA
- Number of Positions or Pins (Grid): 576 (30 x 30)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Brass
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: FR4 Epoxy Glass
- Operating Temperature: -55°C ~ 125°C
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