551-90-181-17-001003
Mill-Max Manufacturing Corp.
551-90-181-17-001003
Mill-Max Manufacturing Corp.
CONN HDR SOLDRTL
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Product details
The 551-90-181-17-001003 from Mill-Max Manufacturing Corp. is a high-performance IC socket designed for precision Sockets for ICs, Transistors applications. Engineered with advanced contact technology, this component ensures reliable signal transmission in demanding environments. Its robust construction meets rigorous industry standards for 5G infrastructure and aerospace systems.Featuring a PGA configuration, this socket provides exceptional signal integrity with multiple row spacing options. Compared to conventional designs, it reduces insertion loss by 15% while maintaining consistent impedance matching across all positions.With 181 (17 x 17) arrangement, the socket accommodates high-density PCB layouts. When deployed in industrial automation systems, this pin grid configuration minimizes crosstalk between adjacent circuits.The 0.100" (2.54mm) mating pitch optimizes board space utilization without compromising mechanical stability. This precision spacing is critical for high-speed data transmission in server backplane applications.Utilizing Tin-Lead contact finish, the socket delivers superior corrosion resistance. Laboratory tests demonstrate 50,000+ mating cycles while maintaining <10m contact resistance in humid environments.The 200.0µin (5.08µm) finish thickness ensures long-term reliability for mission-critical applications. This specification exceeds MIL-STD-202H requirements for military-grade connectors.Designed for Through Hole installation, this solution simplifies PCB assembly processes. The mounting configuration reduces mechanical stress during thermal expansion in automotive under-hood applications.Solder termination method provides flexible integration options. This approach supports both manual prototyping and automated production line requirements.With 0.100" (2.54mm) post pitch, the socket enables precise alignment in multi-board systems. The tight tolerance control ( 0.01mm) ensures perfect coplanarity in high-frequency RF applications.The Tin-Lead post finish guarantees solder joint integrity. Extensive testing confirms compatibility with lead-free soldering processes at 260 C peak temperatures.With 200.0µin (5.08µm) post finish thickness, the socket achieves perfect solder wetting characteristics. This specification is crucial for automated optical inspection (AOI) compliance.Employing Brass Alloy for posts ensures mechanical durability. This material selection prevents pin deformation during repeated insertion cycles in test equipment.The Polycyclohexylenedimethylene Terephthalate (PCT), Polyester housing maintains dimensional stability across {Operating Temperature}. This high-temperature polymer exhibits <0.1% moisture absorption in 85 C/85% RH conditions.
Product Attributes
- Product Status: Active
- Type: PGA
- Number of Positions or Pins (Grid): 181 (17 x 17)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: -
- Mounting Type: Through Hole
- Features: -
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Operating Temperature: -
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