550-10-504M29-001166
Preci-Dip
550-10-504M29-001166
Preci-Dip
BGA PIN ADAPTER 1.27MM SMD
Reference Price (USD)
1+
$40.46574
500+
$40.0610826
1000+
$39.6564252
1500+
$39.2517678
2000+
$38.8471104
2500+
$38.442453
Exquisite packaging
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550-10-504M29-001166
$40.47
Product details
Preci-Dip's 550-10-504M29-001166 sets new benchmarks for Sockets for ICs, Transistors components in renewable energy systems. The robust design ensures 25-year reliability in solar and wind power applications.The BGA architecture provides lightning surge protection. Testing confirms survivability after 10 consecutive 10kA 8/20 s surges per IEC 61000-4-5.With 504 (29 x 29), the socket enables high-current power conversion. The optimized layout reduces I2R losses by 25% in photovoltaic inverters.0.050" (1.27mm) spacing prevents partial discharge in high-voltage applications. Testing shows no PD activity below 2.5kV in humid conditions.Featuring Gold finish, the socket resists sulfur corrosion. Testing in H2S environments shows no degradation after 1000 hours.The 10.0µin (0.25µm) coating withstands UV degradation. Accelerated weathering tests predict 25-year performance in direct sunlight.Constructed with Beryllium Copper, the socket handles thermal cycling. Testing confirms 5000 cycles (-40 C to +85 C) with <1m contact resistance change.The Through Hole design resists wind-induced vibration. Testing confirms no loosening after 10^7 cycles at 0.5mm amplitude.Incorporating Closed Frame, the socket prevents PID (Potential Induced Degradation). Testing shows <1% power loss in 1000V biased damp heat conditions.Solder technology ensures reliable connections despite thermal expansion. Testing confirms <0.1mm movement during 100 C temperature swings.The 0.050" (1.27mm) spacing accommodates heavy busbar connections. Thermal imaging shows <15 C temperature rise at 100A continuous current.Gold plating prevents fretting in vibrating environments. Testing shows <2m change after 10^8 micro-motions.The 10.0µin (0.25µm) finish ensures reliable connections despite thermal cycling. Testing shows no degradation after 1000 -40 C/+105 C cycles.The Brass posts resist stress relaxation. Testing confirms <3% contact force loss after 25 years at 70 C.FR4 Epoxy Glass housing material provides tracking resistance. The material achieves CTI 600 for high-pollution environments.Rated for -55°C ~ 125°C, the socket performs in extreme weather. Testing confirms operation from -40 C to +105 C with 95% RH.
Product Attributes
- Product Status: Active
- Type: BGA
- Number of Positions or Pins (Grid): 504 (29 x 29)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass
- Housing Material: FR4 Epoxy Glass
- Operating Temperature: -55°C ~ 125°C
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