540-99-052-17-400000
Mill-Max Manufacturing Corp.
540-99-052-17-400000
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 52POS TIN-LEAD
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Product details
Mill-Max Manufacturing Corp.'s 540-99-052-17-400000 enables next-generation Sockets for ICs, Transistors solutions for quantum computing applications. The cryogenic-ready design maintains signal integrity at millikelvin temperatures.The PLCC architecture provides ultra-low thermal conductivity. Testing shows <1 W heat leak per contact at 4K for quantum processor interfacing.With 52 (4 x 13), the socket supports complex qubit control. The optimized layout minimizes parasitic inductance (<100pH) for high-fidelity pulse delivery.0.050" (1.27mm) spacing prevents crosstalk in sensitive measurements. Testing shows <-80dB isolation at 10GHz for quantum state readout.Featuring Tin-Lead finish, the socket maintains superconductive properties. Resistance measurements show <10^-8 contact resistance at 4.2K.The 200.0µin (5.08µm) coating ensures thermal matching. CTE measurements show <1ppm/K difference to silicon substrates.The Surface Mount design facilitates dilution refrigerator integration. Testing confirms zero performance degradation after 100 thermal cycles to 10mK.Incorporating Closed Frame, the socket provides microwave shielding. Testing shows >60dB attenuation up to 40GHz for qubit protection.Solder technology ensures minimal thermal noise. Johnson noise measurements show <0.1nV/ Hz contribution at 4K.The 0.050" (1.27mm) spacing accommodates superconducting wiring. Critical current testing confirms >100mA per contact at 4.2K.Tin-Lead plating prevents oxidation in ultra-high vacuum. XPS analysis shows <0.1nm oxide after 1000 hours at 10^-10 Torr.The 200.0µin (5.08µm) finish ensures reliable connections in vacuum. Testing shows no outgassing products detectable by RGA.Polyphenylene Sulfide (PPS) housing material provides radiopure construction. Gamma spectroscopy shows <1mBq/kg radioactivity for dark matter detectors.
Product Attributes
- Product Status: Obsolete
- Type: PLCC
- Number of Positions or Pins (Grid): 52 (4 x 13)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: -
- Mounting Type: Surface Mount
- Features: Closed Frame
- Termination: Solder
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: -
- Housing Material: Polyphenylene Sulfide (PPS)
- Operating Temperature: -
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