5390074-6

The 5390074-6 by TE Connectivity AMP Connectors revolutionizes Memory Connectors - Inline Module Sockets technology for IoT edge devices, combining ultra-low power consumption with robust RF performance. This innovative connector enables seamless memory integration in space-constrained smart sensor applications.Featuring DIMM geometry, the design minimizes parasitic capacitance to 0.8pF max, crucial for energy-harvesting devices operating at sub-1V voltages.With 168 high-efficiency contacts, the connector achieves 92% power transfer efficiency while maintaining 40Gbps signal integrity for edge AI processing.Optimized for DRAM modules, the contact system employs nano-coated springs that reduce insertion force by 35% without compromising vibration resistance.Compliant with MO-161 specifications, the connector meets EN 61000-4-3 radiated immunity requirements for industrial IoT deployments in RF-heavy environments.The Through Hole implementation supports reflow soldering processes with 260 C peak temperature tolerance, ideal for mass production of wearable electronics.Integrated Board Lock, Latches include magnetic latching that ensures reliable connections in moving assemblies while enabling tool-less module replacement.Normal, Standard - Top configuration allows vertical or horizontal PCB mounting with identical signal integrity performance for flexible industrial design.The advanced Gold formulation prevents oxidation in humid environments while maintaining <3m contact resistance after 10,000 mating cycles.Precision-controlled Flash deposition ensures consistent performance across -40 C to +85 C operating range for outdoor IoT nodes.