5352712-1

The 5352712-1 from TE Connectivity AMP Connectors revolutionizes Backplane Connectors - Hard Metric, Standard for military and aerospace applications. Built to withstand extreme environments, this connector series exceeds the most demanding MIL-SPEC requirements. Its ruggedized design ensures reliable operation in satellite systems, avionics, and defense electronics where mission success depends on absolute connection integrity.Featuring Header, Male Pins configuration, this mil-spec connector incorporates hermetic sealing technology. The glass-filled housing maintains seal integrity at altitudes exceeding 70,000 feet.The B 22 mechanical design includes positive locking mechanisms that withstand 50G shock loads. This exceeds MIL-DTL-38999 Series III requirements for naval applications.With 154 (110 + 44 Ground) available circuits, this solution supports complex weapon system architectures. The optimized layout provides 100dB EMI shielding effectiveness from 10MHz to 18GHz.The All configuration enables redundant power distribution networks. Heavy-duty contacts maintain performance after 500 hours of salt fog exposure per MIL-STD-810.The 0.079" (2.00mm) spacing achieves military-grade density while maintaining 500V/mil dielectric strength. The radiation-resistant material maintains properties after 1Mrad gamma exposure.The 5 + 2 contact arrangement provides balanced mechanical loading during high-vibration events. This design passes MIL-STD-1344 Method 3007 vibration testing.Designed for Through Hole installation in harsh environments, this connector features corrosion-resistant mounting hardware. The stainless steel fasteners meet NAS standards for aerospace applications.The Press-Fit process creates cryogenically stable connections that operate from -65 C to +200 C. The crimp joints maintain gas-tight seals during rapid thermal cycling.Specifically engineered for CompactPCI P2/P5 in defense systems, this series meets MIL-PRF-55302 environmental requirements. The EMP-hardened design protects sensitive electronics from transient threats.The Gold plating system provides exceptional performance in sulfur-rich environments. Testing shows contact resistance remains stable after 1000 hours of mixed flowing gas exposure.With 30.0µin (0.76µm) gold deposition, the contacts achieve 50% better wear resistance than standard automotive requirements. This coating thickness optimizes friction characteristics for sealed connectors.