532823-2

TE Connectivity AMP Connectors's 532823-2 delivers aerospace-grade performance in Backplane Connectors - Contacts for satellite communications. Meeting ESA ECSS-Q-ST-70-13 standards, this connector maintains signal integrity in vacuum conditions while withstanding 500 thermal cycles between -196 C and +150 C.The Power implementation features outgassing-resistant materials with total mass loss <0.1% as per NASA outgassing tests. This prevents contamination of sensitive optical surfaces in space applications.Featuring Socket configuration with redundant contact paths, the design ensures mission-critical reliability. Each contact is individually rated for 10^8 operations in microgravity environments.The Solder, PCB process utilizes cold-welding techniques suitable for space vacuum applications. The gas-tight joints demonstrate leak rates below 1 10^-9 mbar l/s when tested with helium mass spectrometry.Gold surface treatment includes gold-over-nickel diffusion barriers that prevent intermetallic growth. Extended life testing shows contact resistance stability through 15 years of simulated GEO orbit conditions.The 30.0µin (0.76µm) specification is optimized for atomic oxygen resistance in LEO environments. Ground testing confirms less than 5% thickness reduction after 5,000 equivalent sun hours of UV exposure.