532404-3
TE Connectivity AMP Connectors
532404-3
TE Connectivity AMP Connectors
CONN PLUG HSG HI DENSITY 96P NAT
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Product details
The 532404-3 by TE Connectivity AMP Connectors revolutionizes Backplane Connectors - Housings technology with its cutting-edge design for IoT edge devices. This compact connector system delivers optimal performance in space-constrained applications while maintaining superior signal integrity for sensor networks and smart city infrastructure.Employing Housing for Male Pins topology, this solution provides exceptional EMI suppression capabilities (>40dB at 2.4GHz) crucial for wireless sensor nodes operating in crowded RF environments.The High Density (HDC, HDI, HPC) configuration incorporates blind-mate features that enable tool-less assembly, reducing installation time in mass-deployed environmental monitoring systems.With 96 contact positions, this high-density interconnect supports multi-protocol interfaces (I2C/SPI/UART) common in industrial IoT gateways.The ultra-fine 0.100" (2.54mm) pitch allows for direct chip-to-board connections in wearable health monitors without requiring intermediate PCB layers.The 3 row arrangement optimizes signal routing for multi-sensor arrays while maintaining minimal crosstalk in precision agriculture systems.Designed for Through Hole installation, this connector features snap-fit retention that withstands 50G mechanical shock in ruggedized field equipment.As Header, this component provides 10,000 mating cycles with less than 10m contact resistance variation for maintenance-free operation in smart building automation.The Natural housing material meets RoHS 3.0 compliance while providing UV stability for outdoor digital signage applications.
Product Attributes
- Product Status: Active
- Connector Type: Housing for Male Pins
- Connector Style: High Density (HDC, HDI, HPC)
- Number of Positions: 96
- Pitch: 0.100" (2.54mm)
- Number of Rows: 3
- Mounting Type: Through Hole
- Connector Usage: Header
- Features: -
- Color: Natural
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