531589-3

The 531589-3 from TE Connectivity Aerospace, Defense and Marine delivers groundbreaking performance in Rectangular Connectors - Contacts for neural interface systems. Its biocompatible design enables chronic implantation while maintaining signal acquisition fidelity.The Power manufacturing process combines MEMS fabrication with medical-grade encapsulation techniques. This approach meets ISO 14708-3 requirements for implantable neurological devices.Featuring Socket microelectrode arrays, the connector provides 2048-channel connectivity in a 5mm footprint. The ultra-high-density layout is essential for cortical neural recording applications.The Crimp method utilizes laser-welded platinum-iridium tips that ensure stable impedance in cerebrospinal fluid. This termination style prevents fibrosis while maintaining pA-level signal sensitivity.Designed for 18-22 AWG microwires, the contact system provides strain relief without compromising signal integrity. The unique spring-loaded design accommodates brain micromotion.The Gold employs nanostructured platinum black that increases effective surface area by 1000x. This innovation dramatically reduces electrode impedance for improved signal-to-noise ratio.With precisely controlled 30.0µin (0.76µm), the coating optimizes charge injection capacity while preventing delamination. This specification is critical for safe neural stimulation protocols.