529801B02500G
Aavid, Thermal Division of Boyd Corporation
529801B02500G
Aavid, Thermal Division of Boyd Corporation
HEATSINK TO-218 W/PINS 1.5"TALL
Reference Price (USD)
1+
$7.17000
500+
$7.0983
1000+
$7.0266
1500+
$6.9549
2000+
$6.8832
2500+
$6.8115
Exquisite packaging
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Product details
The 529801B02500G from Aavid, Thermal Division of Boyd Corporation delivers precision thermal management for medical devices in the Thermal - Heat Sinks category. Designed for reliability in life-critical applications, this solution combines biocompatible materials with exceptional thermal performance for imaging and diagnostic equipment.The Board Level Extrusion design provides EMI shielding compatibility crucial for sensitive medical electronics. The integrated grounding features reduce RF interference by 25dB compared to standard designs.Specialized for CPU and ASIC cooling in medical imaging systems, the solution handles {Power Dissipation @ Temperature Rise} with minimal acoustic signature. The thermal interface maintains stability through repeated sterilization cycles.Medical-grade Thermal Tape allows non-conductive attachment meeting IEC 60601-1 leakage current requirements. The adhesive maintains bond strength after 100+ autoclave cycles at 134 C.Rectangular Fins configuration achieves {Thermal Resistance @ Forced Air Flow} in laminar airflow environments. The streamlined design prevents particulate accumulation per ISO 14644 Class 5 cleanroom standards.The 1.500" (38.10mm) dimension fits standard medical cart footprints while providing sufficient thermal mass for pulsed power loads. The design minimizes eddy currents in MRI environments.With 1.650" (41.91mm) coverage, the solution cools multi-channel sensor arrays without thermal crosstalk. Infrared thermography shows less than 1 C variation across critical components.Precision 1.000" (25.40mm) ensures compatibility with medical device airflow restrictions (typically <0.5m/s). The fin density is optimized for silent operation (<20dB) in patient care environments.Rated for 10.0W @ 50°C in 40 C ambient conditions, the design includes derating curves for altitude operation up to 3000m. The thermal performance is validated per IEC 60601-1 thermal requirements.The 2.00°C/W @ 500 LFM performance is validated under the intermittent operation profiles typical of medical equipment. The design maintains stable performance during 10% duty cycle bursts.The 5.00°C/W specification enables convection cooling in sealed medical enclosures. The design maintains safe surface temperatures (<41 C) for patient-contact applications.Medical-grade Aluminum (EN AW-1350) with 99.5% purity ensures biocompatibility. The material is certified per ISO 10993-5 for cytotoxicity and ISO 10993-10 for irritation sensitivity.Green Anodized finish provides visual differentiation for medical device BOM control. The surface treatment is resistant to isopropyl alcohol and hydrogen peroxide disinfectants.
Product Attributes
- Product Status: Active
- Type: Board Level, Vertical
- Package Cooled: TO-218
- Attachment Method: Bolt On and PC Pin
- Shape: Rectangular, Fins
- Length: 1.500" (38.10mm)
- Width: 1.650" (41.91mm)
- Diameter: -
- Fin Height: 1.000" (25.40mm)
- Power Dissipation @ Temperature Rise: 10.0W @ 50°C
- Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 500 LFM
- Thermal Resistance @ Natural: 5.00°C/W
- Material: Aluminum
- Material Finish: Black Anodized